
Samsung won more than $200 billion of Broadcom chip work through 2030
Samsung signed an MOU with Broadcom worth more than $200 billion through 2030 across memory, 2nm foundry and advanced packaging. Nvidia locked up SK Hynix the same day.

Samsung signed an MOU with Broadcom worth more than $200 billion through 2030 across memory, 2nm foundry and advanced packaging. Nvidia locked up SK Hynix the same day.

HBM stacks for AI accelerators outbid the DRAM in phones and laptops. Qualcomm, Roku and Google have all repriced, and IDC sees PC prices up 18.3% this year.

Tim Cook told the WSJ that Apple price rises are unavoidable as an AI-driven memory crunch quadruples DRAM and NAND costs across every consumer device.

Nintendo confirmed a $50 Switch 2 price increase effective September 1 in the US, citing market conditions. The DRAM shortage caused by AI buildouts is the trigger.

Samsung's union voted to walk out May 21 over a bonus gap that sees SK Hynix engineers pocket roughly 4x more. 200+ have already defected.

DDR5 contract prices jumped 100% since 2025, HBM is eating 23% of DRAM wafers, and the fabs that could fix it don't come online until 2028. Here's the shape of the crunch.