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Macro photograph of a Samsung-branded DRAM chip soldered to a green circuit board, its part number K4T51163QI-HCE6 clearly legible
Hardware·

Samsung won more than $200 billion of Broadcom chip work through 2030

Samsung signed an MOU with Broadcom worth more than $200 billion through 2030 across memory, 2nm foundry and advanced packaging. Nvidia locked up SK Hynix the same day.

Close-up of integrated-circuit packages, the kind of memory and logic chips at the center of South Korea's investment plan
Hardware·

South Korea's $576 billion bet on AI chips runs through Samsung and SK Hynix

South Korea announced a roughly $576 billion (W900 trillion) AI-chip push led by Samsung and SK Hynix, targeting HBM, DRAM fabs, and AI data centers.

Samsung Electronics logo on corporate signage during labor unrest in South Korea
Policy·

Samsung workers are heading for a strike over SK Hynix's bonus checks

Samsung's union voted to walk out May 21 over a bonus gap that sees SK Hynix engineers pocket roughly 4x more. 200+ have already defected.

TrendForce chart showing Q1 2026 memory contract price increases across DRAM and NAND
Hardware·

Why your next RAM kit costs double: the AI memory crunch, explained

DDR5 contract prices jumped 100% since 2025, HBM is eating 23% of DRAM wafers, and the fabs that could fix it don't come online until 2028. Here's the shape of the crunch.