
China built the world's fastest supercomputer without a single US chip
A Chinese system called LineShine debuted at No. 1 on the TOP500 at ISC'26, running entirely on domestic CPUs co-designed with Huawei. Here's what that means.

A Chinese system called LineShine debuted at No. 1 on the TOP500 at ISC'26, running entirely on domestic CPUs co-designed with Huawei. Here's what that means.

South Korea announced a roughly $576 billion (W900 trillion) AI-chip push led by Samsung and SK Hynix, targeting HBM, DRAM fabs, and AI data centers.

The EU signed the US-led 'Pax Silica' pact to secure AI and chip supply chains. Here's what it commits members to, who's in, and how it ties to export controls.

IBM showed a 0.7nm 'nanostack' transistor with ~100 billion transistors on a fingernail. It's real research, but the name is marketing and shipping silicon is years out.

Qualcomm is in talks to buy Tenstorrent for up to $10 billion, per Reuters and The Information. The bet: a RISC-V challenger to Nvidia, not just phones.

Tim Cook told the WSJ that Apple price rises are unavoidable as an AI-driven memory crunch quadruples DRAM and NAND costs across every consumer device.

Alibaba showed the Zhenwu M890 at its Cloud Summit on May 19. 144 GB of memory, 800 GB/s interchip bandwidth, and Qwen3.7-Max riding on top.

SpaceX filed plans for a $55B Terafab semiconductor facility in Grimes County, Texas. Total spend could reach $119 billion across phases.

AMD reported Q1 revenue of $10.25B, up 38% YoY. Data center hit $5.8B (+57%) and Q2 guidance midpoint of $11.2B beat consensus by roughly $700M.

Bloomberg says Apple is in early-stage talks with Intel and Samsung Foundry to build base M-series chips in the US starting 2027. Intel closed at a record $543B market cap.

Samsung Electronics posted record Q1 2026 results on April 30: 133.9 trillion won revenue and 57.2 trillion won operating profit. Semiconductors did 93% of the work.

Leaked slides describe Zen 7 EPYC scaling to 288 cores per socket, with all L3 moved off the CCD onto a stacked cache die. Tape-out is October 2026, launch late 2028.

Anker's Thus chip embeds compute inside NOR flash, claims 150x more on-device AI for noise cancellation, and ships in Soundcore earbuds on May 21. Here's why it matters.

Verkor's Design Conductor agent went from a 219-word spec to a tape-out-ready RISC-V core called VerCore in 12 hours. The catch: it's still a Celeron.

Cerebras filed an S-1 on April 17 listing as 'CBRS,' targeting roughly $23B at the prior private mark. The OpenAI inference deal is the line item that changed the story.

Elon Musk said Tesla plans to manufacture at Terafab in Austin on Intel's 14A process. It's the first major external customer Intel CEO Lip-Bu Tan needs to keep the foundry alive.

Samsung's union voted to walk out May 21 over a bonus gap that sees SK Hynix engineers pocket roughly 4x more. 200+ have already defected.