
Samsung won more than $200 billion of Broadcom chip work through 2030
Samsung signed an MOU with Broadcom worth more than $200 billion through 2030 across memory, 2nm foundry and advanced packaging. Nvidia locked up SK Hynix the same day.

Samsung signed an MOU with Broadcom worth more than $200 billion through 2030 across memory, 2nm foundry and advanced packaging. Nvidia locked up SK Hynix the same day.

HBM stacks for AI accelerators outbid the DRAM in phones and laptops. Qualcomm, Roku and Google have all repriced, and IDC sees PC prices up 18.3% this year.

AMD launched the Instinct MI455X and its Helios rack-scale system, tying 72 GPUs and 31TB of HBM4 into one machine to challenge Nvidia's data-center grip.

South Korea announced a roughly $576 billion (W900 trillion) AI-chip push led by Samsung and SK Hynix, targeting HBM, DRAM fabs, and AI data centers.

Tim Cook told the WSJ that Apple price rises are unavoidable as an AI-driven memory crunch quadruples DRAM and NAND costs across every consumer device.

Samsung Electronics posted record Q1 2026 results on April 30: 133.9 trillion won revenue and 57.2 trillion won operating profit. Semiconductors did 93% of the work.

Samsung's union voted to walk out May 21 over a bonus gap that sees SK Hynix engineers pocket roughly 4x more. 200+ have already defected.

DDR5 contract prices jumped 100% since 2025, HBM is eating 23% of DRAM wafers, and the fabs that could fix it don't come online until 2028. Here's the shape of the crunch.